We found 1 loan(s) for Oshkosh Plating Technologies Inc meeting or exceeding the public reporting minimum of $150k.
| Loan Amount Range | e $150,000-350,000 |
| Business Name as Filed | OSHKOSH PLATING TECHNOLOGIES, INC. |
| Address | 1228 W SOUTH PARK AVE OSHKOSH, WI 54902 |
| NAICS Code [Industry] | 332999 |
| Business Type | Subchapter S Corporation |
| Race / Ethnicity | Unanswered |
| Gender | Unanswered |
| Veteran | Unanswered |
| Jobs Retained | 23 |
| Date Approved | 2020-04-07 |
| Lender | Horicon Bank |
| CD | WI - 06 |