Current business record

HYLINK (USA) DIGITAL SOLUTION CO., LTD.

We found 2 public loan records at or above $150,000 in the current SBA release.

This is a historical government-data listing. It does not establish wrongdoing, eligibility, forgiveness, or the final amount disbursed.

Loan 1

$350,000–1 million
Filed business name
HYLINK (USA) DIGITAL SOLUTION CO., LTD.
Approval date
May 1, 2020
Initial approval amount
$539,985.00
Current approval amount
$539,985.00
Loan status
Paid in Full (Jul 22, 2021)
Forgiveness amount
$545,717.84
Jobs reported
420
Address
225 SANTA MONICA BLVD 8 FL
SANTA MONICA, CA 90401
Lender
JPMorgan Chase Bank, National Association
NAICS code
541512
Business type
Subchapter S Corporation
Congressional district
CA-33

Loan 2

$350,000–1 million
Filed business name
HYLINK (USA) DIGITAL SOLUTION CO. LTD.
Approval date
Feb 4, 2021
Initial approval amount
$489,242.00
Current approval amount
$489,242.00
Loan status
Paid in Full (Apr 20, 2022)
Forgiveness amount
$494,516.03
Jobs reported
30
Address
225 Santa Monica Blvd Fl 8
Santa Monica, CA 90401-2208
Lender
JPMorgan Chase Bank, National Association
NAICS code
541613
Business type
Subchapter S Corporation
Congressional district
CA-36