Current business record

MOUND TECHNOLOGIES INC

We found 1 public loan record at or above $150,000 in the current SBA release.

This is a historical government-data listing. It does not establish wrongdoing, eligibility, forgiveness, or the final amount disbursed.

Loan details

$350,000–1 million
Filed business name
MOUND TECHNOLOGIES INC
Approval date
May 1, 2020
Initial approval amount
$890,300.00
Current approval amount
$890,300.00
Loan status
Paid in Full (Jul 22, 2021)
Forgiveness amount
$900,479.10
Jobs reported
51
Address
25 MOUND PARK DR
SPRINGBORO, OH 45066
Lender
JPMorgan Chase Bank, National Association
NAICS code
332312
Business type
Not reported
Congressional district
OH-01